Canteliver Probe Card
MPI Cantilever Probe Card is greatly used on gold bump and pad wafer tests for display driver, logic, and memory unit. MPI’s cantilever probes would be the corresponding response towards the demands of fine pitch, little pad sizing, significant pace, significantly less cleaning, multi-DUT, substantial pin count, and extremely-minimal leakage needs. With outstanding craftsmanship, modern architecture and demonstrated methodologies based on mechanical and electrical simulation/measurement effects, earning MPI the highest cantilever service provider around the globe.
FCB Probe Card
The FCB Probe Card is the most mature technological innovation of buckling beam probe card. It can be aimed to accomplish the semiconductor ship manufacture time-to-marketplace (TTM) and value of check (COT) desire. FCB is actually a verified Option for various semiconductor generation assessments from early engineering pilot-runs to superior volume manufacturing (HVM). FCB is ready for system requiring superior sign integrity probing (SI) and/or electric power integrity probing (PI). Programs include chopping-edge SiPs/SoCs, WLP, graphic processors, micro processor, industrial microcontrollers, plus more. FCB guarantees the planet’s best All round cost-of-possession (COO) for several DUT purposes.
EVS Probe Card
The EVS Probe Card is surely an improvement more than the traditional buckling beam probe card. Critical characteristics are bigger latest carrying potential (C.C.C.) and reduced well balanced Call drive (BCF), in addition to All round MEMS-like characteristics. EVS can easily satisfy the prerequisite of Superior wafer probing. Exact alignment and great planarity control are classified as the vital things contributing to stable contact resistance. With its capacity and efficiency, EVS Probe Card is an excellent choice for Innovative probe cards.
Osprey probe card
The Osprey probe card is MPI’s Answer to read more demand for ever finer pitch. It is suitable for more compact Al pad, and it is perfect for very small pitch application with peripheral and full array sample. With exact alignment and better planarity control, Osprey can access higher productiveness by multi-DUT design. The forming wire (FW) form needle generated with MPI’s personal micro fabrication procedure not only provides substantial-top quality efficiency but in addition permits simple needle substitution and shortens preserving cycle time.
Kestrel Probe Card
The Kestrel Probe Card is provided with MEMS wire (MW) needle that's designed for the desire of minimal drive probing. Furthermore, it comes along with the ability to fulfill large C.C.C. and substantial pin counts application. The MEMS approach makes certain remarkably dependable needle traits, along with the Exclusive framework structure permits exact alignment and planarity Management.
MPI probe card division provides a wide range of solutions to the semiconductor wafer level test market. Integrated Circuit (IC) applications include Drivers, Logic, CIS, RF, Flip Chip and Cu Pillars. MPI’s comprehensive designs, robust manufacturing and state-of-the-art tooling, enables MPI to provide unsurpassed solutions globally for your challenges both today and for many generations to come.
https://www.mpi-corporation.com/probecard/